Custom Black Conductive ESD Component JEDEC Matrix Trays For IC Device Storage
Built for precision fit and reusability, our JEDEC trays simplify component handling from fab to final test.
This JEDEC matrix tray is engineered to meet the precision and efficiency demands of modern electronics manufacturing. Designed for seamless integration with automated systems, it offers reliable positioning and static protection for a wide variety of components. The tray’s rugged construction supports repeated handling cycles without warping or deformation, while its intelligent design features contribute to safe, accurate operation throughout transport, processing, and storage. Trusted across industries, it provides a robust packaging and handling solution for even the most delicate electronic parts.
Features & Benefits:
• JEDEC-Compliant Structure: Built to industry-standard outline and configuration for guaranteed compatibility with pick-and-place systems and tray feeders.
• ESD-Safe Composition: Ensures secure protection for static-sensitive parts throughout assembly and testing stages.
• Precision Pocket Layout: Engineered for tight part retention and uniform placement, enabling error-free operation in high-speed workflows.
• Automation Support Features: Includes standard alignment and orientation markers that work with automated visual and mechanical systems.
• Stacking Stability: Optimized tray interface design supports safe vertical stacking without shifting or misalignment.
• High Material Resilience: Maintains form and strength across repeated cycles of loading, unloading, and transport under standard manufacturing conditions.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*12.5mm |
| Model | HN23028 | Cavity Size | 11.4*16.9*1.14mm |
| Package Type | N/A | Matrix QTY | 13*7=91PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Applications:
Ideal for a wide range of manufacturing and handling tasks, this tray serves semiconductor production lines, automated testing equipment, and packaging systems. It is frequently used to transport and store microelectronic devices, ensuring their alignment and protection during transitions between production phases. The tray’s standardization also allows for its use in cross-platform production setups, making it suitable for global supply chain operations.
Customization:
The tray is available with multiple customization options to suit specific operational or device needs:
• Tailored Pocket Geometry: Modify shape and depth to support custom chip packages, modules, or hybrid assemblies.
• Color Coding Options: Multiple material color variants available for line segmentation, part tracking, or inventory management.
• Molded Part Identifiers: Incorporate logos, serial numbers, or batch indicators for internal traceability and process validation.
• Automation Compatibility Adjustments: Alter specific features to better align with proprietary robotic arms, elevators, or handling systems.
